LED explosion -proof light radiator naturally needs to choose metal as a radiator material. For the selected materials, it hopes that it has a high ratio and high heat conduction coefficient at the same time. It can be seen from the above It is gold and aluminum, but gold and silver are too expensive. Therefore, the current heat sink is mainly made of aluminum and copper. In comparison, copper and aluminum alloy have their own advantages and disadvantages at the same time: the heat conduction of copper, but the price is more expensive, the processing is difficult, the weight is too large, and the thermal capacity of the copper radiator is small, and it is easy to oxidize Essence

    On the other hand, the pure aluminum is too soft and cannot be used directly. The aluminum alloy used can provide sufficient hardness. The advantages of aluminum alloy are low price and light weight, but thermal conductivity is much worse than copper. In order to strengthen the heat dissipation of the LED explosion -proof light, the past FR4 printing circuit board is not enough to cope with it. Therefore, a printing circuit board with the core of the metal core is called MCPCB. It uses the bottom -bottomed aluminum or copper and other heat -conducting metals with better heat -conducting metals at the bottom Accelerate heat dissipation, but it is also limited by the thermal conductivity of the insulation layer. For light, the substrate is either transparent enough to prevent it from hindering the light, or add a reflective material layer between the luminous layer and the substrate to avoid the light that can be hindered and absorbed by the substrate and forms waste. In addition The substrate material must also have good thermal conductivity, and is responsible for the heat released by the nude crystal to the lower layer of the heat dissipation block. Thermal paste. At the same time, the epoxy resin or silicon resin (seal layer) above the nude crystal must also have a certain heat resistance ability, so as to start with the temperature from the P-N connector and transmit to the surface of the nude crystal surface. In addition to strengthening the substrate, another method is the crystal inlaid. The naked crystal electrode above the LED explosion -proof lamp is connected below. The electrode is directly connected to the bottom foil. This kind of heat dissipation method is not only used on LEDs, but today high -heat CPUs and GPUs have also implemented this lane to accelerate heat dissipation.