The radiator of the LED explosion-proof lamp naturally chooses metal as the material of the radiator. For the selected material, it is hoped that it has high specific heat and high thermal conductivity at the same time. It can be seen from the above that silver and copper are excellent thermal conductivity materials, followed by It is gold and aluminum, but gold and silver are too expensive, so at present, heat sinks are mainly made of aluminum and copper. In comparison, both copper and aluminum alloys have their own advantages and disadvantages: copper has good thermal conductivity, but it is expensive, difficult to process, heavy, and the heat capacity of copper radiators is small, and it is easy to oxidize. .

On the other hand, pure aluminum is too soft to be used directly. Only aluminum alloys are used to provide sufficient hardness. The advantages of aluminum alloys are low price and light weight, but the thermal conductivity is much worse than that of copper. In order to strengthen the heat dissipation of the LED explosion-proof lamp, the FR4 printed circuit board in the past is no longer enough. Therefore, a printed circuit board with a metal core inside, called MCPCB, is used. Accelerates heat dissipation, but also has several limitations on heat conduction due to the properties of the insulating layer. For light, the substrate is either transparent enough so that it will not block the light, or a reflective material layer is added between the light-emitting layer and the substrate to avoid the light energy being blocked and absorbed by the substrate, resulting in waste. , the substrate material must also have good thermal conductivity, which is responsible for quickly conducting the heat released by the bare die to the lower heat dissipation block, but a good thermal conductivity interface must also be used between the substrate and the heat dissipation block, such as solder or Thermal paste. At the same time, the epoxy resin or silicone resin (sealing layer) above the bare die must also have a certain heat resistance, so as to cope with the temperature from the p-n junction to the surface of the bare die. In addition to strengthening the substrate, another method is flip chip inlay, which transfers the bare die electrode above the LED explosion-proof lamp to the bottom, and the electrode is directly connected to the wire foil at the bottom, so that the heat can be conducted to the bottom faster. This heat dissipation method is not only used in LEDs, but also in today's high-heat CPUs and GPUs to speed up heat dissipation.